International Trend of Tech Symposium
7-8 December 2024, İstanbul - Türkiye - Hybrid (In-person and Virtual)
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WELCOME TO ITTSCONF 2024
ITTSCONF aims to advance the discourse on engineering technologies, thereby shaping technological innovation across multiple disciplines. ITTSCONF seeks to unlock the transformative potential inherent in smart technologies across these diverse fields by focusing on research spanning theoretical insights, empirical studies, and practical applications.
The technical program of ITTSCONF 2024 will include the presentation of invited speakers and regular sessions. ITTSCONF is an international symposium that shares the research results of universities, research groups, companies, and technology groups from many countries. ITTSCONF aims to create collaborative networks of universities, researchers, and the private sector.
Authors are invited to submit full papers for consideration in the symposium. All submitted papers will be double-blind, peer-reviewed, and evaluated based on originality, research content, correctness, relevance to the symposium, and readability. Only accepted papers will be presented and published in the symposium proceedings.
Keynote Speakers
IMPORTANT DATES
SYMPOSIUM SCOPE
Track 1: Emerging Technologies
Artificial Intelligence (AI) and Machine Learning (ML) - Internet of Things (IoT) - Quantum Computing - Blockchain Technology - 5G and Wireless Communication - Augmented Reality (AR) and Virtual Reality (VR) - Edge Computing
Track 2: Sustainability and Environmental Engineering
Renewable Energy (solar, wind, hydro, geothermal) - Energy Efficiency and Storage Solutions - Carbon Capture and Storage (CCS) - Circular Economy and Zero Waste Technologies - Sustainable Materials and Green Building Technologies - Water Resource Management and Treatment - Climate Change Mitigation and Adaptation Technologies
Track 3: Robotics and Automation
Autonomous Systems (drones, self-driving cars) - Industrial Automation and Smart Manufacturing - Human-Robot Interaction - Robotic Process Automation (RPA) - Mechatronics and Cyber-Physical Systems
Track 4: Materials Science and Engineering
Nanotechnology and Nano Materials - Advanced Composites and Alloys - 3D Printing and Additive Manufacturing - Smart Materials (shape memory alloys, responsive polymers) - Biomaterials and Medical Devices - Materials for Energy Storage and Conversion
Track 5: Civil and Structural Engineering
Smart Cities and Urban Infrastructure - Sustainable Building Design and Construction - Earthquake-Resistant Structures - Transportation Systems Engineering - Geotechnical Engineering and Soil Mechanics - Water Resources and Hydrological Engineering - Infrastructure Maintenance and Asset Management
Track 6: Electrical and Electronics Engineering
Power Systems and Smart Grids - Energy Generation, Transmission, and Distribution - Renewable Energy Integration - Signal Processing and Telecommunications - Microelectronics and Semiconductor Devices - Embedded Systems and IoT Devices - Control Systems Engineering
Track 7: Mechanical and Aerospace Engineering
Thermodynamics and Heat Transfer - Fluid Mechanics and Aerodynamics - Propulsion Systems - Computational Fluid Dynamics (CFD) - Aerospace Materials and Structures - Space Exploration Technologies - Autonomous Vehicles and UAVs (Unmanned Aerial Vehicles)
Track 8: Chemical and Biochemical Engineering
Process Engineering and Optimization - Chemical Reaction Engineering - Biofuels and Sustainable Energy - Bioprocess Engineering and Biotechnology - Environmental and Green Chemistry - Polymer Science and Engineering - Pharmaceuticals and Drug Delivery Systems
Track 9: Computer Science and Software Engineering
Cybersecurity and Information Assurance - Big Data Analytics and Data Science - Cloud Computing and Distributed Systems - Software Development and Agile Methodologies - Human-Computer Interaction (HCI) - DevOps and Automation in Software Development - Software Testing and Quality Assurance
Track 10: Biomedical and Healthcare Engineering
Biomedical Imaging and Signal Processing - Wearable Devices and Telemedicine - Tissue Engineering and Regenerative Medicine - Health Informatics and Medical Data Analytics - Prosthetics and Orthotics - Robotics in Surgery and Healthcare - Medical Devices and Diagnostics
Track 11: Ethics, Policies, and Standards in Engineering
Engineering Ethics and Responsible Innovation - Regulatory Compliance and Engineering Standards - Ethical AI and Data Privacy - Safety and Risk Management in Engineering - Intellectual Property and Patents in Engineering - Global Challenges and Sustainable Development Goals (SDGs)
Track 12: Education and Professional Development
Innovations in Engineering Education - STEM Education Initiatives - Virtual Laboratories and Remote Learning - Interdisciplinary Engineering Education - Professional Certifications and Continuing Education - Diversity, Equity, and Inclusion in Engineering - Leadership and Project Management in Engineering
Paper Submission
| Paper Process |
⇨ Papers must be prepared at the highest level of quality . ⇨ Papers have a maximum page limit of 6 pages including references, graphs and figures. ⇨ Since the acceptance rate will be kept below 60%, priority will be given to papers with high review scores. ⇨ A speaker can present a maximum of 3 papers. An author's name can be included on maximum 5 papers. |
| Plagiarism Rate | 20% without references, 30% with references at most |
| Plagiarism Rate | 20% without references, 30% with references at most |
| Official Language | Turkish and English |
| Paper Submission |
Abstract, full paper and poster presentations are accepted for ITTSCONF 2024.
Abstract/Poster Template Full Paper Template IJMSIT Template The relevant template must be used in whichever publication option you want for your work. The evaluation and publication selection processes of the studies are followed through templates.  Click to send a paper with SETCMS Participants who do not want to use the SETCMS system can send their work to ittsconf@gmail.com by e-mail. |
Registration Fees
» The second paper for the same speaker is free.
» After the registration fee is paid, your registration will be completed. You do not need to take any additional action for registration.
» Registration fee is a fixed 50 USD / 1500 TL for all participant types.
» Registration fee includes Certificate of Participation, badge, publication and tea/coffee for 1 day.
» A "Certificate of Participation" will be issued only to those who pay the participation fee, register and make their presentations.
» Payment must be made after the acceptance letter is sent to you. You can make the payment through the paper management system (SETCMS).
» Taxes are included.
Committees
ITTSCONF 2024 Honorary Chair
Prof. Dr. Şehmus Demir, Gaziantep İslam Science and Technology University, Türkiye
ITTSCONF 2024 General Chairs
Prof.Dr. Tanupriya Choudhury, Graphic Era Deemed to be University, Dehradun, India
Dr. Ebubekir Yaşar, Tokat Gaziosmanpaşa University, Türkiye
ITTSCONF 2024 Co-Chairs
Dr. Bhupesh Kumar Dewangan, OP Jindal University, Punjipathra, India
Dr. Ankit Vishnoi, Graphic Era Deemed to be University, Dehradun, India
ITTSCONF 2024 Advisory Committees
Prof. Anil Kumar, IFTM University, Moradabad, India
Prof. Metin Bedir, Gaziantep İslam Science and Technology University, Türkiye
Prof. Muharrem Düğenci, Karabük University, Türkiye
Prof. Neelu Trivedi, IFTM University, Moradabad, India
Prof. Osman Bilgin, Gaziantep İslam Science and Technology University, Türkiye
Prof. Shahnaz N. Shahbazova, Azerbaijan State University of Economics, Azerbaijan
Dr. Ali Durmuş, Kayseri University, Türkiye
Dr. Doğan Çiloğlu, Atatürk University, Türkiye
Dr. İpek Atik, Gaziantep İslam Science and Technology University, Türkiye
Dr. M. Fatih Karaca, Tokat Gaziosmanpaşa University, Türkiye
Dr. Oleksandr Laptiev, Taras Shevchenko National University of Kyivi, Ukraine
Dr. Sachi Nandan Mohantey, School of Computer Science Engineering, Singhidunum University, Serbia
Dr. Vinay Kandpal, Graphic Era Deemed to be University, Dehradun, India
ITTSCONF 2024 Technical Program Committee Members
Prof. Dieu Hack-Polay, Crandall University, Moncton, CanadaProf. Jung-Sup Um, Kyungpook National University, South Korea
Prof. Nguyen Gia Nhu, Duy Tan University, Da Nang, Vietnam
Prof. Sachi Nandan Mohanty, Univerzitet Singidunum, Serbia
Prof. Teoh Teik Toe, NTU Singapore
Prof. Thinagaran Peramul, Universiti Putra, Malaysia
Prof. Vaclav Skala, University of West Bohemia, Plzeň, Czech Republic
Dr. Aditi Sharma, Symbiosis International Univerity, Pune, India
Dr. Amit Kumar Mondal, Manipal University Dubai UAE
Dr. Anindya Ghatak, Bennett University, Greater Noida, India
Dr. Anurag Jain, UPES, Dehradun, India
Dr. Ashutosh Sharma, Henan University of Science and Technology, Luoyang, Henan, China
Dr. Avita Katal, UPES, Dehradun, India
Dr. Bhaskar Mondal, National Institute of Technology Patna
Dr. Bhupesh kumar Devangan, OP Jindal University, Raigarh, Chhattisgarh, India
Dr. Bireshwar Dass Mazumdar, Bennett University, Greater Noida, India
Dr. Biswajit Jana, Bennett University, Greater Noida, India
Dr. Danish Ather, Amity University Tashkent Uzbekistan
Dr. Dinesh Chandra Dobhal, Graphic Era Deemed to be University, Dehradun, India
Dr. Faisal Imran, Daffodil International University Bangladesh
Dr. Farhana Tania, Daffodil International University-DIU
Dr. Guru Prasaad, Graphic Era Deemed to be University, Dehradun, India
Dr. Hussain Falih Mahdi, University of Diyala, Iraq
Dr. Jitendra Rajpurohit, Symbiosis International Univerity, Pune, India
Dr. Luxmi Sapra, Graphic Era Hill University, Dehradun, India
Dr. Madhu Khurana, University of Gloucestershire, United Kingdom
Dr. Neelam Singh, Graphic Era Deemed to be University, Dehradun, India
Dr. Parul Madan, Graphic Era Deemed to be University, Dehradun, India
Dr. Pawan Kumar Mishra, Graphic Era Deemed to be University, Dehradun, India
Dr. Prakash Srivastava, Graphic Era Deemed to be University, Dehradun, India
Dr. Prashant K. Gupta, Bennett University, Greater Noida, India
Dr. Praveen Kumar, Astana IT University, Kazakhstan
Dr. Ragavendra Agarwal, GIET University, Gunupur, India
Dr. Richa Chaudhary, UPES, Dehradun, India
Dr. Rohit Tanwar, UPES, Dehradun, India
Dr. Roohi Sille, UPES, Dehradun, India
Dr. Sarvesh Vishwakarma, Graphic Era Deemed to be University, Dehradun, India
Dr. Seema Rawat, Amity University Tashkent Uzbekistan
Dr. Shahina Anwarul, UPES, Dehradun, India
Dr. Shlpa Gite, Symbiosis International Univerity, Pune, India
Dr. Shrikant Tiwari, Galgotias University, Greater Noida, India
Dr. Sugandha Sharma, UPES, Dehradun, India
Dr. Turgut Özseven, Tokat Gaziosmanpaşa University, Turkiye
Dr. Varsha Mittal, Graphic Era Deemed to be University, Dehradun, India
Dr. Varun Sapra, UPES, Dehradun, India
Dr. Ved Prakash Mishra, Amity University Dubai
Mr. Kamred Udham Singh, Graphic Era Deemed to be University, Dehradun, India
Ms. Vandana Rawat, Graphic Era Deemed to be University, Dehradun, India
Abhiroop Khanna, UPES, Dehradun, India
Ritu Agarwal, UPES, Dehradun, India
Sayantan Chakraborty, International Association of Professional and Fellow Engineers-Delaware-USA
Call for Papers
Publishing
Abstract Submission
Abstracts will be published in the abstract book with ISBN.
Publication will take place within 2 weeks after the symposium.
Full Paper
Full papers will be published in the proceeding with ISBN.
Each paper will be published on SETSCI by giving DOI.
Publication will take place within 2 weeks after the symposium.
Poster Submission
Poster papers will be published in the poster book with ISBN.
Publication will take place within 2 weeks after the symposium.
Contact
Address
Istanbul - Turkiye
Call Us
+90 541 606 70 58
+90 542 246 76 19
Email Us
ittsconf@gmail.com